Products News

As the trend of semiconductor miniaturization and aerospace lightweighting accelerates, the reliability and functional requirements of high-performance materials continue to rise.

Extreme environment testing at JPL confirms Sunkye Electronics' Kovar (Fe/Ni/Co 54/29/17) TO-8 packages maintained ≤2×10⁻¹¹ atm·cc/s helium leak rates after 5,000 thermal cycles (-196°C/+200°C) — surpassing MIL-STD-883H Method 1014.9 requirements by 400%. This breakthrough in Coefficient of Thermal Expansion (CTE) engineered glass-to-metal seals (GTMS) solves signal degradation in photonics and RF systems facing brutal thermal gradients

If you are eager to completely conquer the precision machining of the aperture of the Kovar alloy package shell, and easily solve the airtightness of the optical module and the supply chain delivery time problem, then this is the most precious gift you will receive in this life.

The global electronic packaging and high-airtightness component market is experiencing a wave of technological iteration to meet the reliability and miniaturization requirements in extreme environments.

The global optical communication market demand continues to grow, and high-speed, high-density optical module packaging technology has become the focus of the industry. Recently, Zion Communication Technology Co., Ltd. (hereinafter referred to as Zion) announced that it will use innovative Kovar packaging tube shells in its new generation of 800G optical module products, which significantly improves the reliability and signal integrity of the product in extreme environments, and provides key technical guarantees for the deployment of 5G base stations, marine communications and hyperscale data centers.